Package prevented from the EMC flowing into via hole during the PCB fabricating process and the manufacturing method thereof

摘要

PURPOSE: A package and a method for manufacturing the same are provided to reduce the size of the circuit and simplify the configuration of the circuit in packages for infrared data association. CONSTITUTION: A method for manufacturing a package, comprises a step of processing through holes on a printed circuit board; a step of plating the printed circuit board with a conductive material; a step of depositing an insulating or conductive ink on the printed circuit board, and filling the through holes with an insulating or conductive ink; a step of processing a blind via hole(55) on the lower surface of the printed circuit board; and a step of coating the inner wall of the blind via hole with a conductive material by plating the printed circuit board with another conductive material.