METHOD FOR FORMING FUSE OF DUAL DAMASCENE PROCESS TO MINIMIZE SHORT FAILURE

摘要

PURPOSE: A method for forming a fuse of a dual damascene process is provided to remove a residual metal layer and form uniformly a surface of an insulating layer by forming sequentially a metal pad and a fuse opening. CONSTITUTION: A wiring pattern and a fuse pattern(64) are formed on a substrate by using a dual damascene process. A passivation layer(68) is formed on the entire surface of the substrate including the wiring pattern and the fuse pattern. A pad opening for exposing a part of the wiring pattern is formed by patterning the passivation layer. A metal pad(72p) having an expanded part is formed on the wiring pattern within the pad opening. The expanded part of the metal pad is expanded to the passivation layer adjacent to the pad opening. A fuse opening(74) is formed by etching partially the passivation layer on the fuse pattern.