首页> 外国专利> Manufacturing method of BiCMOS device with surface channel PMOS transistor

Manufacturing method of BiCMOS device with surface channel PMOS transistor

机译:具有表面沟道pmos晶体管的biCMOS器件的制造方法

摘要

BiCMOS 10 includes bipolar transistor 60, PMOS transistor 64, and p-type polycrystalline silicon resistor 70. Bipolar transistor 60 includes a collector region formed by emitter electrode 30, base region 26, and well region 18. PMOS transistor 64 includes a source / drain region 52, a gate electrode 40, and a gate oxide 28. PMOS transistor 64 also includes an LDD region 44. Emitter electrode 30 and gate 40 are formed outside the same polycrystalline silicon layer and therefore have the same thickness. Ideally, the emitter electrode 30 and the gate electrode 40 are silicides.
机译:BiCMOS 10包括双极型晶体管60,PMOS晶体管64和p型多晶硅电阻器70。双极型晶体管60包括由发射极30,基极区26和阱区18形成的集电极区。PMOS晶体管64包括源极/漏极。区域52,栅电极40和栅氧化物28。PMOS晶体管64还包括LDD区域44。发射电极30和栅40形成在同一多晶硅层的外部,因此具有相同的厚度。理想地,发射电极30和栅电极40是硅化物。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号