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Multi-exposure method with increased overlay accuracy and recording medium in which the exposure method is recorded

机译:具有提高的重叠精度的多重曝光方法以及其中记录了曝光方法的记录介质

摘要

Multi-exposure lithography systems are provided for improved overlay accuracy. In one aspect, a method for multi-exposure lithography operates by determining overlay parameters corresponding to each of a plurality of sub-layouts, inputting the overlay parameters into an exposure system, exposing each sub-layout to photoresist on a wafer by using the exposure system, wherein prior to the exposure process for a given sub-layout, a correction process is performed for the sub-layout using a corresponding overlay parameter to correct an overlay of the sub-layout, and developing the exposed photoresist after exposing all of the sub-layouts.
机译:提供了多曝光光刻系统以提高覆盖精度。在一个方面,一种用于多曝光光刻的方法通过确定与多个子布局中的每个子布局相对应的覆盖参数,将覆盖参数输入到曝光系统中,通过使用曝光将每个子布局暴露于晶片上的光刻胶来进行操作。系统,其中在给定子布局的曝光过程之前,使用相应的叠加参数对子布局执行校正过程以校正子布局的叠加,并在对所有子布局进行曝光后显影曝光的光刻胶。子布局。

著录项

  • 公开/公告号KR100416618B1

    专利类型

  • 公开/公告日2004-02-05

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20020016820

  • 发明设计人 박준수;박창민;

    申请日2002-03-27

  • 分类号H01L21/027;

  • 国家 KR

  • 入库时间 2022-08-21 22:47:33

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