WAFER DRY APPARATUS FOR DRYING FULLY WAFER AFTER WAFER CLEANING PROCESS

摘要

PURPOSE: A wafer dry apparatus is provided to dry uniformly the entire surface of a wafer by uniformly supplying IPA vapor to an upper part and a lower part of a dry bath. CONSTITUTION: A wafer(20) is loaded on a dry bath(11). A vapor generator(12) is used for generating IPA vapor. A first diffuser(11e-1) is arranged at one side of the dry bath to uniformly inject the IPA vapor onto the wafer. A plurality of vapor pressure control valves(14-1,14-2) are installed between the first diffuser and the vapor generator to control the amount of the IPA vapor. A vent pump(13) is connected between the vapor pressure control valves and the first diffuser. A plurality of speed control valves(15-1,15-2) are used for controlling vapor speed. A second diffuser(11e-2) is opposite to the second diffuser and the wafer is positioned therebetween. An additional vapor pressure valve is installed between the second diffuser and the vapor generator to control the amount of the vapor. An additional speed control valve is installed between the second diffuser and the vent pump to control the vapor speed.