首页> 外国专利> TRANSISTOR STRUCTURE FOR ESD PROTECTION CIRCUIT OF SEMICONDUCTOR DEVICE TO INDUCE UNIFORM DISTRIBUTION OF INJECTED CHARGES AND IMPROVE RELIABILITY OF SEMICONDUCTOR DEVICE

TRANSISTOR STRUCTURE FOR ESD PROTECTION CIRCUIT OF SEMICONDUCTOR DEVICE TO INDUCE UNIFORM DISTRIBUTION OF INJECTED CHARGES AND IMPROVE RELIABILITY OF SEMICONDUCTOR DEVICE

机译:半导体器件ESD保护电路的晶体管结构,以诱导注入电荷的均匀分布并提高半导体器件的可靠性

摘要

PURPOSE: A transistor structure for an ESD(electrostatic discharge) protection circuit of a semiconductor device is provided to induce uniform distribution of injected charges and improve reliability of the semiconductor device by making a low-resistance metal layer come in contact with the upper part of a gate polysilicon layer at regular intervals after the metal layer is deposited on a gate. CONSTITUTION: The first and second terminals are disposed on a semiconductor substrate(20). An active region is coupled to the first and second terminals, disposed in the semiconductor substrate under the first and second terminals. The upper surface of a gate in a direction of a major axis is electrically connected to a metal line through a metal layer filled in a plurality of contact holes. The gate is disposed between the active regions.
机译:目的:提供一种用于半导体器件的ESD(静电放电)保护电路的晶体管结构,以通过使低电阻金属层与半导体器件的上部接触来诱导注入电荷的均匀分布并提高半导体器件的可靠性。在将金属层沉积在栅极上之后,以规则的间隔形成栅极多晶硅层。构成:第一和第二端子设置在半导体衬底(20)上。有源区耦合到第一和第二端子,第一和第二端子设置在第一和第二端子下方的半导体衬底中。栅极在长轴方向上的上表面通过填充在多个接触孔中的金属层与金属线电连接。栅极设置在有源区之间。

著录项

  • 公开/公告号KR100449180B1

    专利类型

  • 公开/公告日2004-09-07

    原文格式PDF

  • 申请/专利权人 HYNIX SEMICONDUCTOR INC.;

    申请/专利号KR19970081109

  • 发明设计人 YANG JONG YEOL;

    申请日1997-12-31

  • 分类号H01L27/04;

  • 国家 KR

  • 入库时间 2022-08-21 22:46:40

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