Semiconductor wafer with electrically connected contact and test surfaces and after treatment process has passive contact region and test surfaces in active component region of chip

摘要

A semiconductor wafer having many chips has electrically connected contact (1) and test (2) surfaces with the contacts being in a passive region (5) of the upper chip (1) where there are no IC components. The test surfaces are in a second, active, region (7) which comprise active components. An Independent claim is also included for an after treatment process for the wafer above.