A process for preparation of a micromechanical device with a substrate, a membrane, and a hollow space by etching useful in electronics for thermal decoupling between structural elements and substrates

摘要

A process for preparation of a micromechanical device with a substrate material (10), a membrane (20), a hollow space (30) in a membrane region (21) between the substrate material and the membrane, where the hollow space is obtained by etching a hole (40) in the membrane by a first anisotropic etching step followed by etching with a second, isotropic etching step. An independent claim is included for a micromechanical device with a substrate and membrane as described above.