Microthermal column device has substrate, floating membrane on substrate, etching window dividing membrane, micro structures connecting membrane, recess between substrate/membrane

摘要

The device has a substrate, a floating membrane (24) formed on the upper surface of the substrate, an etching window dividing the membrane, a number of micro connecting structures (28) crossing the window and connecting the divided membrane on both sides of the etching window and a recess formed between the substrate and the membrane. The substrate is a silicon substrate and the membrane is at least one protruding arm. Independent claims are also included for the following: a method of providing thermal insulation for a microthermal column device.