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Thin film transistors for macroelectronics: Devices, substrates, and processes.

机译:用于宏电子学的薄膜晶体管:设备,基板和工艺。

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Recent advances in thin-film transistor technology and the rapid growth of the flat-panel display industry have stimulated interest as well as increased demand for large-area electronics. Applications are not only limited to displays, but also include sensors, RFID tags, smart cards, and disposable electronics. The list is growing. The current toolset used in the microelectronics industry, however, is designed to achieve high-resolution over small areas, and thus is ill-equipped to address the size and cost requirements for this new breed of electronics. At its core, this is a fundamentally different kind of technology which we seek, and as such, we have given it a name: Macroelectronics.; We investigate several key technologies which are essential to any macroelectronic process. To increase throughput in manufacturing, a web process utilizing a flexible yet strong substrate is required. We therefore examine the performance of TFTs fabricated on thin steel foils of various thickness, ranging from 200 mum to 1 mum, and find that the electrical performance is relatively constant, while the mechanical behavior of the substrates may vary widely throughout the fabrication process. Analysis of film stress reveals a substrate thickness dependence which is in agreement with observed substrate bending characteristics.; A direct patterning approach is also investigated. For the large-area substrates required in macroelectronic applications, this patterning method can potentially achieve much higher throughput at much lower costs than is currently possible using conventional optical steppers. We characterize the electrical performance of the devices made using electrophotographically-patterned toner masks and find that they compare well with devices made using traditional photolithographic methods.; Finally, we propose and fabricate a transistor structure which is not subject to the performance limitations characteristic of current device structures. Specifically, these devices lower the delay associated with addressing individual gate lines, which is critical as display sizes and resolutions increase. Characterization of these devices reveals performance metrics which agree well with predicted values and which are clearly superior to those of conventional devices.; We conclude by proposing future work which can be done here at Princeton in the area of macroelectronics, and summarize the key points and results presented in this work.
机译:薄膜晶体管技术的最新进展以及平板显示行业的迅速发展激发了人们的兴趣以及对大面积电子产品的需求增加。应用不仅限于显示器,还包括传感器,RFID标签,智能卡和一次性电子产品。名单正在增长。但是,微电子工业中使用的当前工具集旨在在小面积上实现高分辨率,因此无法满足这种新型电子产品的尺寸和成本要求。从本质上讲,这是我们寻求的一种根本不同的技术,因此,我们给它起了一个名字:Macroelectronics。我们研究了对任何宏观电子过程都至关重要的几种关键技术。为了增加制造中的产量,需要利用柔性但坚固的基底的网工艺。因此,我们检查了在200毫米至1微米范围内的各种厚度的薄钢箔上制造的TFT的性能,发现电性能相对恒定,而基板的机械性能在整个制造过程中可能会发生很大变化。对膜应力的分析揭示了基底厚度的依赖性,该依赖性与观察到的基底弯曲特性一致。还研究了直接图案化方法。对于宏观电子应用中所需的大面积基板,与目前使用常规光学步进器相比,这种构图方法可以以更低的成本获得更高的产量。我们对使用电子照相图案化的墨粉掩模制成的器件的电性能进行了表征,发现它们与使用传统光刻方法制成的器件具有很好的比较。最后,我们提出并制造了一种不受当前器件结构性能限制特性影响的晶体管结构。具体地说,这些设备降低了与寻址单个栅极线相关的延迟,这在显示器尺寸和分辨率提高时至关重要。这些设备的特性表明其性能指标与预测值非常吻合,并且明显优于传统设备。最后,我们提出了可以在普林斯顿进行的宏观电子领域的未来工作,并总结了这项工作提出的要点和结果。

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