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METHOD FOR EVALUATING SILICON SINGLE-CRYSTAL WAFER, AND SILICON SINGLE-CRYSTAL WAFER USING THE SAME
METHOD FOR EVALUATING SILICON SINGLE-CRYSTAL WAFER, AND SILICON SINGLE-CRYSTAL WAFER USING THE SAME
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机译:硅单晶硅片的评估方法,以及使用硅单晶硅片的硅单晶硅片
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摘要
PROBLEM TO BE SOLVED: To provide a method which is applied to a manufacturing process carried out prior to shipment of wafers, and evaluates a state of surface of a wafer by exposing latent strain on the surface.;SOLUTION: In a step (1) of the method, a silicon single-crystal wafer is subjected to an elicitation process wherein a heating process is carried out under a condition of not less than 900-1,250°C×1 sec at rising and falling temperature rates of 10-300°C/sec, and then the surface state of the silicon single-crystal wafer is evaluated. This elicitation process is carried out preferably, by using a sheet-feed type heat-treating furnace in order to enable factors causing process strains to be determined appropriately. In a step (2), the evaluation method of the step (1) is applied after the chamfering process of the wafer.;COPYRIGHT: (C)2006,JPO&NCIPI
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机译:解决的问题:提供一种方法,该方法适用于在运送晶片之前进行的制造过程,并通过在表面上暴露潜在的应变来评估晶片表面的状态。解决方案:在步骤(1)中在该方法中,对硅单晶晶片进行激发处理,其中在不低于900-1,250℃×1秒的条件下以10-30℃的升温和降温速率进行加热工艺。 C / sec,然后评估硅单晶晶片的表面状态。优选地,通过使用片材进给型热处理炉来进行该引发处理,以使得能够适当地确定引起处理应变的因素。在步骤(2)中,在对晶片进行倒角处理之后应用步骤(1)的评估方法。版权所有:(C)2006,JPO&NCIPI
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