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SEALING STRUCTURE OF MICRO ELECTRONIC MECHANICAL SYSTEM, SEALING METHOD THEREFOR, AND MICRO ELECTRONIC MECHANICAL SYSTEM

机译:微电子机械系统的密封结构,密封方法及微电子机械系统

摘要

PROBLEM TO BE SOLVED: To provide a sealing structure of a micro electronic mechanical system capable of protect by individually and excellently sealing a movable part of the micro electronic mechanical system(MEMS).;SOLUTION: In the sealing structure of a micro electronic mechanical system which seals a micro electronic mechanical structure 2 formed on a substrate 1 in the space between the substrate 1 and a sealing member 3 formed on the substrate 1 so as to cover the micro electronic mechanical system 2, the sealing member 3 is composed of a first sealing member 4 placed on the space side and having a through hole 4a and a second sealing member 5 placed on the outside of the sealing member 4 and closing the through hole 4a. The micro electronic mechanical structure 2 and the sealing structure can be formed through a series of processes. The sealing structure can be formed on an extremely local part of the micro electronic mechanical structure 2 and the periphery. Consequently, an extremely small micro electronic mechanical system can be provided by the sealing structure excellent in mass production effect.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:要解决的问题:提供一种微电子机械系统的密封结构,该结构能够通过单独且出色地密封微电子机械系统(MEMS)的活动部分来进行保护。;解决方案:在微电子机械系统的密封结构中密封构件3由第一构件构成,该构件在基板1和形成在基板1上的密封构件3之间的空间中密封形成在基板1上的微电子机械结构2,以覆盖微电子机械系统2。密封件4位于空间侧并具有通孔4a和第二密封件5,第二密封件5位于密封件4的外侧并封闭通孔4a。可以通过一系列过程来形成微电子机械结构2和密封结构。密封结构可以形成在微电子机械结构2的非常局部的部分和周边上。因此,通过具有大量生产效果的密封结构,可以提供极小的微电子机械系统。版权所有:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP2005123561A

    专利类型

  • 公开/公告日2005-05-12

    原文格式PDF

  • 申请/专利权人 KYOCERA CORP;

    申请/专利号JP20040048239

  • 发明设计人 YONEDA RYUJI;FUKANO TORU;

    申请日2004-02-24

  • 分类号H01L23/08;

  • 国家 JP

  • 入库时间 2022-08-21 22:37:04

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