Protective cover and electronic component e.g. micro electro-mechanical system, welding or sealing method for protecting component against e.g. impact, involves depositing sealing material with indium on one of wettability areas

摘要

The method involves producing wettability areas (10, 11) on opposing faces of protective cover and electronic components, where one area has a layer of gold and a surface area (S2) greater than a surface area (S1) of the other area. A quantity of sealing material comprising indium is deposited on one of the areas by evaporation. The wettability area (11) is brought into contact with the deposited material. Temperature of a chamber containing the elements is raised to 250 degree Celsius in a non-oxidizing atmosphere, in order to seal the cover and the components to one another by remelting.