首页> 外国专利> REFINING FOR REMOVING IRON, NICKEL, ETC., IN TIN-BASE LEAD-FREE SOLDER AND TIN-LEAD BASE SOLDER BY FORMING COPPER EUTECTIC BODY

REFINING FOR REMOVING IRON, NICKEL, ETC., IN TIN-BASE LEAD-FREE SOLDER AND TIN-LEAD BASE SOLDER BY FORMING COPPER EUTECTIC BODY

机译:通过形成铜共晶体来精炼去除锡基无铅焊料和锡铅基焊料中的铁,镍等

摘要

PPROBLEM TO BE SOLVED: To obtain a desired simple technique because a large facility and many processes are needed for refining for removing iron, nickel, etc. in a recycle-refining for tin-base lead-free solder and tin-lead base solder in the conventional technique, and the skill of an operator in charge of the recycle-refining is required. PSOLUTION: Respective eutectic bodies having high melting points, are generated by combining copper with iron, nickel, etc., by adding the copper at a high temperature zone, from the conventional solder recycle-refining at the low temperature zone, and the temperature is lowered again to near the melting point to separate and remove the iron, nickel, etc. PCOPYRIGHT: (C)2005,JPO&NCIPI
机译:

要解决的问题:由于在锡基无铅焊料和锡铅的回收精炼中需要大量的设备和许多工序来精炼去除铁,镍等,因此需要一种简单的技术来解决需要传统技术中的基础焊料,以及负责回收精炼的操作员的技能。

解决方案:熔点高的共晶体是通过将铜与铁,镍等结合,通过在高温区添加铜而产生的,这是从低温区的常规焊料回收精制中得到的,并且再次降低温度至熔点附近,以分离并除去铁,镍等。

版权所有:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP2005042191A

    专利类型

  • 公开/公告日2005-02-17

    原文格式PDF

  • 申请/专利权人 SHIROGANE:KK;

    申请/专利号JP20030299353

  • 发明设计人 IJICHI YOSHITO;

    申请日2003-07-22

  • 分类号C22B9/10;C22B7/00;C22C3/00;

  • 国家 JP

  • 入库时间 2022-08-21 22:33:22

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