THIXOTROPY APPLICATION AGENT FOR SOLDER PASTE, AND SOLDER PASTE

摘要

PROBLEM TO BE SOLVED: To provide a thixotropy application agent for solder paste which does not easily separate flux and solder powder when leaving it at a room temperature over a long period in the case it is made into solder paste, and to provide solder paste which has satisfactory printability and has no sagging at the time of heat-treating a printed part (paste film) owing to its incorporation.;SOLUTION: The thixotropy application agent for solder paste comprises a ≥24C fatty acid diamide having ≥3 hydroxy groups by ≥50 mass% to the whole. The melting point of the fatty acid diamide is preferably ≥160°C.;COPYRIGHT: (C)2005,JPO&NCIPI