PROCESS FOR FABRICATING THIN FILM INTEGRATED CIRCUIT DEVICE, NONCONTACT THIN FILM INTEGRATED CIRCUIT DEVICE AND ITS FABRICATION PROCESS, ID TAG AND COIN HAVING NONCONTACT THIN FILM INTEGRATED CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a thin film integrated circuit which can be mass produced at low cost, and to provide its fabrication process.;SOLUTION: The process for fabricating a thin film integrated circuit device comprises steps for forming a release layer on a substrate, for forming an underlying film on the release layer, for forming a plurality of thin film integrated circuits on the underlying layer, for forming grooves on the boundary of the plurality of thin film integrated circuits, for introducing gas or liquid containing fluorine halide to the grooves, and for separating the plurality of thin film integrated circuits by removing the release layer. Consequently, a thin film integrated circuit being employed in a thin film integrated circuit device can be fabricated at low cost.;COPYRIGHT: (C)2005,JPO&NCIPI