首页> 外国专利> TENSILE DISTORTIONAL SILICON ON LOOSENED SiGe FILM CONTAINING EVEN MISFIT DISLOCATION DENSITY AND FORMING METHOD OF SAME

TENSILE DISTORTIONAL SILICON ON LOOSENED SiGe FILM CONTAINING EVEN MISFIT DISLOCATION DENSITY AND FORMING METHOD OF SAME

机译:包含均匀错位错位的松散SiGe薄膜上的拉伸变形硅及其形成方法

摘要

PPROBLEM TO BE SOLVED: To provide an effective manufacturing method of a loosened SiGe layer. PSOLUTION: A compressed distortional SiGe layer is formed on a silicon substrate. An EOR damage is given by performing an ionic injection of atoms onto the SiGe layer. Annealing is performed to loosen the distorted SiGe layer. An interstitial dislocation loop is formed as uniformly distributed in the SiGe layer during the annealing. The interstitial dislocation loop is a base for the nucleation of the misfit dislocation between the SiGe layer and the silicon substrate. Since the interstitial dislocation loop is uniformly distributed, the misfit dislocation is uniformly distributed as well, thereby the SiGe layer is loosened. The tensile distortional silicon layer is formed on the loosened SiGe layer. PCOPYRIGHT: (C)2005,JPO&NCIPI
机译:

要解决的问题:提供一种松散的SiGe层的有效制造方法。

解决方案:在硅基板上形成压缩的变形SiGe层。通过将原子离子注入到SiGe层上,会产生EOR损坏。进行退火以使变形的SiGe层变松。间隙位错环形成为在退火期间均匀地分布在SiGe层中。间隙位错环是成核SiGe层和硅衬底之间失配位错的基础。由于间隙位错环均匀分布,所以失配位错也均匀分布,从而使SiGe层松弛。拉伸变形硅层形成在疏松的SiGe层上。

版权:(C)2005,JPO&NCIPI

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