DRY ETCHING METHOD USING LIGHT EMISSION, DRY ETCHING CONTROL DEVICE AND DRY ETCHING DEVICE HAVING THE CONTROL DEVICE

摘要

PROBLEM TO BE SOLVED: To readily adjust selectivity to a target value.;SOLUTION: A lookup table of light emission strength and treatment conditions and selectivity in dry etching is prepared in advance. When dry etching is started, light emission intensity of plasma emission is detected, compared with selectivity which is the target set in an etching program. When it is not the plasma emission strength corresponding to the set selectivity, dry etching treatment conditions are adjusted based on data of the lookup table so that emission strength of plasma light emission is the plasma light emission strength corresponding to the target selectivity.;COPYRIGHT: (C)2005,JPO&NCIPI