首页> 外国专利> MULTIBEAM SEMICONDUCTOR LASER AND ITS MANUFACTURING METHOD, MULTIBEAM SEMICONDUCTOR LASER ARRAY, PLATE MAKING APPARATUS FOR PRINTING, AND IMAGE RECORDING APPARATUS

MULTIBEAM SEMICONDUCTOR LASER AND ITS MANUFACTURING METHOD, MULTIBEAM SEMICONDUCTOR LASER ARRAY, PLATE MAKING APPARATUS FOR PRINTING, AND IMAGE RECORDING APPARATUS

机译:多光束半导体激光器及其制造方法,多光束半导体激光器阵列,印版制版装置和图像记录装置

摘要

PROBLEM TO BE SOLVED: To provide a multibeam semiconductor laser which can be increased in the rated output by suppressing the heat conduction from a substrate to eliminate the thermal influence from adjacent light emitting sections, and can rapidly output a high-resolution image.;SOLUTION: The multibeam semiconductor laser comprises the plurality of light emitting sections, each comprising a plurality of semiconductor layers including the contact layer of a first conductivity, a clad layer of the first conductivity, an active layer, a clad layer of a second conductivity, and a contact layer of the second conductivity; ohmic electrodes which are formed in correspondence with the respective light emitting sections and are electrically connected to the contact layer of the first conductivity and the contact layer of the second conductivity of each light emitting section; and the substrate which supports the plurality of light emitting sections and the ohmic electrodes. The substrate is made of a material having a lower coefficient of thermal conductivity than that of a semiconductor material of which the light emitting sections are made.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:要解决的问题:提供一种多光束半导体激光器,该激光器可以通过抑制基板的热传导来消除相邻发光部分的热影响,从而提高额定输出,并可以快速输出高分辨率图像。 :多光束半导体激光器包括多个发光部,每个发光部包括多个半导体层,该多个半导体层包括第一导电性的接触层,第一导电性的包覆层,有源层,第二导电性的包覆层和具有第二导电性的接触层;对应于各个发光部分而形成的欧姆电极,其分别与每个发光部分的第一导电性的接触层和第二导电性的接触层电连接;支撑多个发光部和欧姆电极的基板。基板由具有比制成发光部的半导体材料低的导热系数的材料制成。版权所有:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP2005039003A

    专利类型

  • 公开/公告日2005-02-10

    原文格式PDF

  • 申请/专利权人 RICOH CO LTD;

    申请/专利号JP20030199154

  • 发明设计人 HARA TAKASHI;

    申请日2003-07-18

  • 分类号H01S5/022;

  • 国家 JP

  • 入库时间 2022-08-21 22:28:58

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