It is low method and the device for energy by the micro jet in plasma processing ion occurrence and transport

摘要

Topic Low offer occurrence of the energy which is used with plasma processing of the semiconductor wafer ion and transporting system and the device.SolutionsGenerating the plasma from gas kind, it forms plasma discharges, style introduces into the processing room 16. Ion content in the midst of plasma discharges style is increased by operating auxiliary ion source 74, primary plasma discharge is formed during plasma discharges style with that. Next, primary plasma discharge is forwarded in baffle plate assembly 54, when the plasma flows out from baffle plate assembly 54, secondary plasma discharge is formed. It occurs and due to primary plasma discharge and during secondary plasma discharging strength of the electric field which operates the ion which is included is decreased, the ion collides to wafer 18 low by the energy which does not give the damage to the semiconductor device which was formed on wafer 18 with that. Selective figure Figure 1