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Semiconductor integrated circuit device design apparatus, semiconductor integrated circuit design method, and semiconductor integrated circuit design program

机译:半导体集成电路器件设计装置,半导体集成电路设计方法和半导体集成电路设计程序

摘要

An apparatus executes wire layout design in an integrated circuit. The apparatus includes a logic cell arrangement information acquisition unit which acquires information concerning a logic cell arrangement on a chip, a wire-grouping unit which estimates wires between logic cell terminals based on the acquired information and groups the estimated wires into each wire layer region, a via setting unit which sets via wire for pulling a logic cell terminal up to a wire layer region, a wire information extraction unit which extracts wire information for each of the wire groups and a routing execution unit which executes routing between the logic cell terminals for each of the wire layer regions based on the extracted information. A method for executing wire layout design in an integrated circuit includes acquiring information concerning a logic cell arrangement on a chip, executing wire-grouping, setting via wire for pulling a logic cell terminal up to a wire layer region, extracting wire information for each of the wire groups, and executing routing between the logic cell terminals for each of the wire layer regions based on the extracted information. The wire-grouping contains estimating wires between logic cell terminals based on the acquired information concerning the logic cell arrangement and dividing the estimated wires into each group of a wire layer region.
机译:一种设备在集成电路中执行布线设计。该装置包括:逻辑单元布置信息获取单元,其获取与芯片上的逻辑单元布置有关的信息;导线分组单元,其基于所获取的信息来估计逻辑单元端子之间的导线,并且将所估计的导线分组为每个导线层区域;用于设置逻辑单元端子以将逻辑单元端子拉至布线层区域的布线的通孔设置单元,针对每个布线组提取布线信息的布线信息提取单元以及用于执行逻辑单元端子之间的布线的布线执行单元,用于布线。基于所提取的信息,每个导线层区域。一种用于在集成电路中执行布线设计的方法,包括:获取关于芯片上的逻辑单元布置的信息;执行布线分组;经由布线进行设置,以将逻辑单元端子拉至布线层区域;针对每个布线提取布线信息。布线组,并基于提取的信息对每个布线层区域执行逻辑单元端子之间的布线。导线分组包含基于所获取的关于逻辑单元布置的信息来估计逻辑单元端子之间的导线,并将所估计的导线划分为导线层区域的每组。

著录项

  • 公开/公告号JP3616611B2

    专利类型

  • 公开/公告日2005-02-02

    原文格式PDF

  • 申请/专利权人 株式会社東芝;

    申请/专利号JP20020138399

  • 发明设计人 改田 博政;

    申请日2002-05-14

  • 分类号H01L21/82;G06F17/50;

  • 国家 JP

  • 入库时间 2022-08-21 22:26:31

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