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In2O3 thin film resistivity control by doping metal oxide insulator for MFMox device applications

机译:MFMox器件应用中通过掺杂金属氧化物绝缘体控制In2O3薄膜电阻率

摘要

The present invention discloses a novel ferroelectric transistor design using a resistive oxide film in place of the gate dielectric. By replacing the gate dielectric with a resistive oxide film, and by optimizing the value of the film resistance, the bottom gate of the ferroelectric layer is electrically connected to the silicon substrate, eliminating the trapped charge effect and resulting in the improvement of the memory retention characteristics. The resistive oxide film is preferably a doped conductive oxide in which a conductive oxide is doped with an impurity species. The doped conductive oxide is most preferred to be In2O3 with the dopant species being hafnium oxide, zirconium oxide, lanthanum oxide, or aluminum oxide.
机译:本发明公开了一种新颖的铁电晶体管设计,其使用电阻氧化膜代替栅极电介质。通过用电阻氧化膜代替栅极电介质,并通过优化膜电阻的值,铁电层的底栅电连接到硅衬底,消除了陷阱电荷效应,从而改善了存储保持力特征。电阻氧化物膜优选为掺杂有导电性氧化物的膜,其中,导电性氧化物掺杂有杂质。掺杂的导电氧化物最优选为In 2 O 3 ,其中掺杂物种类为氧化ha,氧化锆,氧化镧或氧化铝。

著录项

  • 公开/公告号US2005151210A1

    专利类型

  • 公开/公告日2005-07-14

    原文格式PDF

  • 申请/专利权人 TINGKAI LI;SHENG TENG HSU;

    申请/专利号US20040755419

  • 发明设计人 TINGKAI LI;SHENG TENG HSU;

    申请日2004-01-12

  • 分类号H01L29/76;

  • 国家 US

  • 入库时间 2022-08-21 22:25:45

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