Semiconductor element, semiconductor device, method for manufacturing semiconductor element, method for manufacturing semiconductor device, and electronic apparatus

摘要

To provide semiconductor elements, semiconductor devices, methods for manufacturing semiconductor elements, methods for manufacturing semiconductor devices, and electronic apparatuses, when composing a thin film device (a semiconductor device) by attaching a micro tile element onto a substrate, the manufacturing cost can be lowered, the short-circuit of wirings for the thin film device can be reduced or prevented and an increase in the parasitic capacitance can be reduced or prevented. A semiconductor element is formed in a micro tile configuration that is provided by cutting and separating the semiconductor element formed on a semiconductor substrate from the semiconductor substrate. The semiconductor element includes a tile section having a tile configuration, and an insulating layer that is formed on the tile section with an insulating member to insulate the electrode section from a desired member. At least a part of the insulating member protrudes from an outer edge of the tile section.