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Semiconductor device obtained by dividing semiconductor wafer by use of laser dicing technique and method of manufacturing the same
Semiconductor device obtained by dividing semiconductor wafer by use of laser dicing technique and method of manufacturing the same
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机译:通过使用激光切割技术分割半导体晶片而获得的半导体器件及其制造方法
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摘要
A semiconductor chip is formed by dividing a semiconductor wafer by use of the laser dicing technique. The semiconductor chip has a laser dicing region on the side surface thereof. A dummy wiring layer is formed along the laser dicing region on the surface layer of the laser dicing region. A laser beam is applied to the dummy wiring layer to divide the semiconductor wafer.
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