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Reducing photoresist line edge roughness using chemically-assisted reflow
Reducing photoresist line edge roughness using chemically-assisted reflow
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机译:使用化学辅助回流降低光刻胶线边缘的粗糙度
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摘要
Line edge roughness may be reduced by treating a patterned photoresist with a plasticizer. The plasticizer may be utilized in a way to surface treat the photoresist after development. Thereafter, the plasticized photoresist may be subjected to a heating step to reflow the photoresist. The reflow process may reduce the line edge roughness of the patterned, developed photoresist.
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