首页>
外国专利>
Method for manufacturing light emitting diode utilizing metal substrate and metal bonding technology and structure thereof
Method for manufacturing light emitting diode utilizing metal substrate and metal bonding technology and structure thereof
展开▼
机译:利用金属基板制造发光二极管的方法及其金属结合技术和结构
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method for manufacturing the light emitting diode utilizing the metal substrate and the metal bonding technology is provided. The method includes steps of providing a growing substrate, forming a multi-layered semiconductor structure on the growing substrate, bonding a metal substrate to the multi-layered semiconductor structure, removing the growing substrate, and forming a first electrode and a second electrode on the multi-layered semiconductor structure and the metal substrate respectively.
展开▼