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Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication, assembly, and operation therefor
Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication, assembly, and operation therefor
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机译:具有不可插入和可插入的导电特征的混合包装,互补的插座及其制造,组装和操作方法
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摘要
A hybrid electronic circuit package (102, FIG. 1) includes non-insertable conductive features (110) and insertable conductive features (112) at a surface of the package. A hybrid receptacle (120), such as a socket, for example, includes non-insertable contacts (124) and insertable contacts (126), which are positioned in a complementary manner with the non-insertable and insertable features of the package. A vertical securement device (132, 134, 136) applies a vertical compressive force to the package (102) to compress the non-insertable features (110) against the non-insertable contacts (124). Further, a normal force securement device can be used to provide a sustained normal force to compress the insertable features and contacts together. In one embodiment, the non-insertable features are land grid array lands and the insertable features are low insertion force features.
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