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Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow
Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow
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机译:使用喷涂或层压工艺处理C4晶片级厚金属集成流的厚ILD层的方法
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摘要
A process flow to make an interconnect structure with one or more thick metal layers under Controlled Collapse Chip Connection (C4) bumps at a die or wafer level. The interconnect structure may be used in a backend interconnect of a microprocessor. The process flow may include forming an inter-layer dielectric with spray coating or lamination over a surface with high aspect ratio structures.
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