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Methods for reducing slurry usage in a linear chemical mechanical planarization system
Methods for reducing slurry usage in a linear chemical mechanical planarization system
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机译:减少线性化学机械平面化系统中浆料用量的方法
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摘要
Methods for dispensing slurry in a linear chemical mechanical planarization (CMP) system are provided. One method involves the use of a pulsing flow of slurry instead of a continuous flow of slurry. Another method involves spraying a mist of slurry onto the polishing pad. Yet another method involves controlling the gap between the nozzles from which the slurry is dispensed and the top surface of the polishing pad. Each of these methods reduces the amount of slurry used during a CMP operation.
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