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Test circuit and multi-chip package type semiconductor device having the test circuit
Test circuit and multi-chip package type semiconductor device having the test circuit
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机译:测试电路以及具有该测试电路的多芯片封装型半导体器件
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摘要
A MCP semiconductor device includes at least first and second chips, each of which has internal pads and an internal circuit, encapsulated by a sealing material together. The device further includes a test circuit. The test circuit connects each of the internal pads to one of the internal circuits under a normal operation mode of the device, and disconnect between them under a test mode.
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