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System and method for effective yield loss analysis for semiconductor wafers
System and method for effective yield loss analysis for semiconductor wafers
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机译:用于半导体晶片的有效良率损失分析的系统和方法
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摘要
This invention relates to a method for yield loss analysis of process steps of semiconductor wafers having a plurality of dies, and more particularly relates to a defect inspection technique to determine a hit ratio, computation of yield impact contributions for the defects, and determination of a kill ratio for a specific type of defect. Yield loss is estimated ultimately upon a choice of a defect density distribution function. A defect calibrated factor and a yield impact calibrated factor are introduced herein.
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