Measurement of thickness of metallic films thick - that do not have more correlation between intensity of X rays and the thickness using X-ray fluorescence spectrometry of energy D.Ispersiva

摘要

"Measure of thickness of thick metallic films that are not more correlation between intensity of X rays and the thickness using X-ray fluorescence spectrometry of energyDispersive.The present invention patent describes the development of a method for measurement of thickness of metallic films (which are not thick more correlation between intensity of X rays and espeThe film ssura) using X-ray fluorescence spectrometry (EDXRF).In the method, the use of metallic shielding under the films was obtaining the measure of thickness, by means of the attenuation of the emission line of the constituent element of the shield.This is verified by EDXRF attenuation. The aluminum film was tested to investigate the accuracy and precision of the proposed method. The installations used were of copper and lead.The measures took place in times less than 100 seconds, showing that the method is fast.The values of correlation coefficients of the analytical curves obtained showed that the technique is promising (r equal to 10000).For the case of aluminum film, the detection limit reached 120 nm showed the applicability to real samples, particularly those with industrial interest.