首页> 外国专利> TITANIUM NITRIDE THIN FILM FORMATION ON METAL SUBSTRATE BY CHEMICAL VAPOR DEPOSITION IN A MAGNETIZED SHEET PLASMA SOURCE

TITANIUM NITRIDE THIN FILM FORMATION ON METAL SUBSTRATE BY CHEMICAL VAPOR DEPOSITION IN A MAGNETIZED SHEET PLASMA SOURCE

机译:磁化板等离子体源中化学气相沉积法在金属基质上形成氮化钛薄膜

摘要

Title: TITANIUM NITRIDE THIN FILM FORMATION ON METALSUBSTRATE BY CHEMICAL VAPOR DEPOSITION IN A MAGNETIZED SHEET PLASMA SOURCEAbstract: A procedure for the synthesis of titanium nitride (UN) thin films on metal substrate by vapor deposition using a magnetized sheet plasma source is disclosed. TIN films on metal substrate exhibiting the stoichiometric TiN and Ti[err]N were synthe-sized in a mixed N[err]/Ar plasma with initial gas filling ratio of preferably 1:3 under the following conditions: total initial gas filling pressure of at least about 40 mTorr, plasma current in the range of about 2A to about 3A and plasma discharge potential in the range of about 125V to about 15OV.
机译:发言题目:金属上的氮化钛薄膜形成磁化板等离子体源中化学蒸气沉积的基质摘要:一种利用气相沉积法在金属基底上气相沉积合成氮化钛(UN)薄膜的方法公开了磁化的片状等离子体源。金属基底上的化学计量为TiN和Ti [errN]的TIN膜是合成的-在以下条件下,将N [err] / Ar混合等离子体的大小确定,初始气体填充比优选为1:3:至少约40 mTorr的压力,约2A至约3A范围内的等离子体电流和该范围内的等离子体放电电势约125V至约15OV。

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