INTEGRATED PARTIAL SAWING PROCESS

摘要

A process for partially sawing the streets on semiconductor wafers. Aftersawing, thestreets can be covered by a protective material, and then the wafer continuesits processing asbefore. After the wafer is broken, the protective material may or may not beremoved.Additionally, the wafer may be broken into individual chips using a wedgepiece that has anumber of individual wedges on it, where the individual wedges press againstthe partially sawnstreets, causing the wafer to break.