In order to produce solder - and bond of a silver layers, whose properties even after a storage time are not impaired, a treatment solution and a method is proposed, in which in contrast to known solutions and the process of the invention, no starting protection compounds are employed. The acid solution contains silver ions to the silver deposition, as well as at least a cu (i) - complexing agents, wherein the cu (i) - complexing agent is selected from the group comprising compounds with the structural element i
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