首页> 外国专利> METHOD FOR PRODUCING ARTICLE HAVING BEEN SUBJECTED TO LOW REFLECTION TREATMENT, SOLUTION FOR FORMING LOW REFLECTION LAYER AND ARTICLE HAVING BEEN SUBJECTED TO LOW REFLECTION TREATMENT

METHOD FOR PRODUCING ARTICLE HAVING BEEN SUBJECTED TO LOW REFLECTION TREATMENT, SOLUTION FOR FORMING LOW REFLECTION LAYER AND ARTICLE HAVING BEEN SUBJECTED TO LOW REFLECTION TREATMENT

机译:进行低反射处理的物品的制造方法,低反射层的形成方法和低反射处理的物品的制造方法

摘要

A low reflection treated article manufacturing method wherein a low reflection layer solution, obtained by mixing and reacting (1) silica microparticles, comprising at least one type of silica microparticles selected from the group consisting of non-aggregated silica microparticles with an average particle diameter of 40 to 1000nm, hollow non-aggregated silica microparticles with an average particle diameter of 10 to 100nm, and chain-like aggregated silica microparticles with an average primary particle diameter of 10 to 100nm, (2) a hydrolyzable silicon compound, water, and a binder solution, containing a solvent and a hydrolysis catalyst for the above-mentioned silicon compound, to hydrolyze the above-mentioned silicon compound and (3) adding a curing catalyst, which promotes the condensation of silanol groups, is coated onto a resin base material and reacted and cured at room temperature or within a range of room temperature to "a temperature at which the base material will not be damaged" (the deformation temperature or less in the case of a thermoplastic resin or the decomposition temperature or less in the case of a hardening resin) to form a low reflection layer, containing silica microparticles and a binder at a solids weight ratio of 30:70 to 95:5.
机译:一种低反射处理的制品的制造方法,其中,低反射层溶液是通过使(1)二氧化硅微粒混合并反应而得到的,该低反射层溶液包含选自平均粒径为1μm以下的非凝集二氧化硅微粒中的至少一种二氧化硅微粒。 40〜1000nm,平均粒径为10〜100nm的中空的非凝集二氧化硅微粒,平均一次粒径为10〜100nm的链状的凝集二氧化硅微粒,(2)水解性硅化合物,水,将包含溶剂和上述硅化合物的水解催化剂的粘合剂溶液水解成上述硅化合物,并且(3)添加促进硅烷醇基的缩合的固化催化剂,将该粘合剂溶液涂覆在树脂基材上并在室温下或在室温至“不会使基材干燥的温度”的范围内反应固化。 ”(如果是热塑性树脂,则为变形温度或更低;如果是硬化树脂,则为分解温度或更低)以形成低反射层,该低反射层包含固含量比为30的二氧化硅微粒和粘合剂: 70至95:5。

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