CMOS IMAGE SENSOR MODULE FABRICATED WITHOUT ADDITIONAL SEALING PROCESS BY USING TRANSPARENT POLYMER MATERIAL AND FABRICATING METHOD FOR REDUCING PRODUCTION COST

摘要

PURPOSE: A CMOS image sensor module and a fabricating method thereof are provided to eliminate a sealing process and reduce a fabrication cost by using a transparent polymer material. CONSTITUTION: A circuit pattern for wire bonding is formed on both sides of a substrate(110). A first semiconductor chip(120) for an image sensor is installed on an upper surface of the substrate by a wire bonding method. A second semiconductor chip(130) for processing digital signals is installed on a lower surface of the substrate by the wire bonding process. A sealing resin part(140) is formed nearly to the first and the second semiconductor chips on a surface of the substrate. The sealing resin part is formed with a transparent polymer.