ultra thine pin for semiconductor package

摘要

PURPOSE: An ultra-light thin pin semiconductor package is provided to be capable of simplifying manufacturing processes by connecting a circuit board and a semiconductor chip using an adhesive polyimide tape and inserting a thin pin into an adhesive hole of the circuit board instead of a wire bonding process and a molding process. CONSTITUTION: When mounting a semiconductor chip(20) on a circuit board(10), an adhesive polyimide tape(40) is used for attaching the semiconductor chip on the circuit board(10). Preferably, the circuit board includes a plurality of adhesive holes(11) and a plurality of thin pins(30) made of silver inserted into each adhesive hole for transferring the electric signal of the semiconductor chip to the outside. Preferably, the semiconductor chip includes a plurality of bond pads(21) corresponding to each thin pin.