首页> 外国专利> METHOD OF MANUFACTURING FLASH MEMORY DEVICE FOR KEEPING DISTRIBUTION OF THRESHOLD VOLTAGE CONTROLLING IONS CONSTANT WITHIN ACTIVE REGION

METHOD OF MANUFACTURING FLASH MEMORY DEVICE FOR KEEPING DISTRIBUTION OF THRESHOLD VOLTAGE CONTROLLING IONS CONSTANT WITHIN ACTIVE REGION

机译:制造用于在有源区域内保持恒定的阈值电压控制离子分布的闪存器件的方法

摘要

PURPOSE: A method of manufacturing a flash memory device is provided to keep the distribution of threshold voltage controlling ions constant within an active region by lowering the temperature of an oxidation for forming a sidewall oxide layer in a trench and performing an ion-implantation for compensating the active region for diffused ions. CONSTITUTION: A first ion-implantation for controlling a threshold voltage is performed on a semiconductor substrate(100). A tunnel oxide layer(102), a first polysilicon layer(104) and a pad nitride layer(106) are sequentially formed thereon and a trench is formed in the substrate by performing etching on the resultant structure. A sidewall oxide layer(112) is formed along the entire surface of the trench by using a dry-oxidation at a temperature range of 800 to 950. A second ion-implantation for compensating the threshold voltage controlling ions diffused into the sidewall oxide layer is performed thereon. An oxide layer is filled in the trench.
机译:用途:提供一种制造闪存装置的方法,以通过降低用于在沟槽中形成侧壁氧化物层的氧化温度并执行用于补偿的离子注入来保持阈值电压控制离子在有源区内的分布恒定。扩散离子的活性区域。构成:用于控制阈值电压的第一离子注入是在半导体衬底上执行的(100)。在其上依次形成隧道氧化物层(102),第一多晶硅层(104)和衬垫氮化物层(106),并通过对所得结构进行蚀刻在衬底中形成沟槽。通过在800至950℃的温度范围内使用干法氧化沿着沟槽的整个表面形成侧壁氧化物层(112)。用于补偿阈值电压控制扩散到侧壁氧化物层中的离子的第二离子注入是:在其上执行。氧化物层填充在沟槽中。

著录项

  • 公开/公告号KR20050002414A

    专利类型

  • 公开/公告日2005-01-07

    原文格式PDF

  • 申请/专利权人 HYNIX SEMICONDUCTOR INC.;

    申请/专利号KR20030043792

  • 发明设计人 LEE KEUN WOO;

    申请日2003-06-30

  • 分类号H01L27/115;

  • 国家 KR

  • 入库时间 2022-08-21 22:06:04

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