首页> 外国专利> FLEXIBLE SUBSTRATE WITH HIGH CONNECTION RELIABILITY, HAVING LEAD PORTION WITH FINE PITCH, AND CONNECTION METHOD THEREOF

FLEXIBLE SUBSTRATE WITH HIGH CONNECTION RELIABILITY, HAVING LEAD PORTION WITH FINE PITCH, AND CONNECTION METHOD THEREOF

机译:具有高连接可靠性的柔性基板,具有精细间距的引线部分及其连接方法

摘要

PURPOSE: A flexible substrate and a connection method thereof are provided to prevent a formation of a bridge between adjacent lead portions, and achieve improved connection reliability. CONSTITUTION: A flexible substrate(10) comprises a base material(13) having a flexibility, and an insulating base film and a conductive film; a plurality of lead portions(15) arranged on an end of the base material; and slits(18) formed between the lead portions. An adhesive member for fixing the base material to an external member is provided in the part of the base material opposed to the external member.
机译:目的:提供一种柔性基板及其连接方法,以防止在相邻的引线部分之间形成桥,并实现改善的连接可靠性。构成:挠性基板(10)包括具有挠性的基材(13),绝缘性的基底膜和导电膜。多个引线部分(15)布置在基材的端部上;在引线部之间形成狭缝(18)。在基材的与外部构件相对的部分中设置有用于将基材固定到外部构件的粘合构件。

著录项

  • 公开/公告号KR20050004020A

    专利类型

  • 公开/公告日2005-01-12

    原文格式PDF

  • 申请/专利权人 SHINKO ELECTRIC INDUSTRIES CO. LTD.;

    申请/专利号KR20040048867

  • 发明设计人 SHIRAISHI SATOSHI;

    申请日2004-06-28

  • 分类号H05K1/02;H05K1/18;

  • 国家 KR

  • 入库时间 2022-08-21 22:06:02

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号