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Chip on Chip Bonding Technology for Fine Pitch Connection with Al-Si/TiN Bumps

机译：芯片贴合技术与Al-Si / Tin凸块的细间距连接

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Masahiro Akiyama; Takahiro Mitsuishi; Dali Zhang; Myung-Jae Lee; Edoardo Charbon;
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年度 2018
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1. Effects of Bonding Parameters on the Reliability of Fine-Pitch Cu/Ni/SnAg Micro-Bump Chip-to-Chip Interconnection for Three-Dimensional Chip Stacking [J] . Lu S.-T. Device and Materials Reliability, IEEE Transactions on . 2012,第2期

机译：键合参数对微间距Cu / Ni / SnAg微凸点微芯片芯片间互连可靠性的影响
2. Ultra-fine pitch chip-on-glass (COG) bonding with metal bumps having insulating layer in the side walls using anisotropic conductive film (ACF) [J] . Hong M.H., Kim S.-C., Kim Y.-H. Current applied physics: the official journal of the Korean Physical Society . 2012,第3期

机译：使用各向异性导电膜（ACF）与侧壁上具有绝缘层的金属凸块进行超细间距玻璃上芯片（COG）接合
3. Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping [J] . Dionysios Manessis, Rainer Patzelt, Andreas Ostmann, Microelectronics & Reliability . 2004,第5期

机译：模板印刷技术对超细间距倒装凸块的技术挑战
4. Laser Assisted Bonding Technology Enabling Fine Bump Pitch in Flip Chip Package Assembly [C] . Chi-Yuan Chen, Ian Hsu, Stanley Lin, Electronic System-Integration Technology Conference . 2018

机译：激光辅助键合技术可在倒装芯片封装中实现小凸点间距
5. Electroplating bonding technology for chip interconnect, wafer level packaging and interconnect layer structures. [D] . Joung, Yeun-Ho. 2003

机译：用于芯片互连，晶圆级封装和互连层结构的电镀键合技术。
6. Comparison of an automated microfluidic immunoassay technology (BioIC lab-on-chips) and ImmunoCAP assay. Lab-on-chips as a tool for specific IgE (sIgE) detection [O] . Izabela Szymczak-Pajor, Rafal Pawliczak 2020

机译：自动微流体免疫测定技术（生物实验室芯片）和免疫谱法测定的比较。实验室芯片作为特定IgE（SiGe）检测的工具
7. Flip-chip bonding of fine-pitch ultra-thin chips for SiF applications [O] . Kusters Roel, Sridhar Ashok, Cauwe Maarten, 2014

机译：用于siF应用的细间距超薄芯片的倒装芯片焊接
8. Flip Chip Assembly of Thin Substrates, Fine Bump Pitch, and Small Prototype Die. [R] . Tomada, A., Blaj, G., Caragiulo, P., 2014

机译：薄基板，精细凸块间距和小型原型模具的倒装芯片组装。

Chip on Chip Bonding Technology for Fine Pitch Connection with Al-Si/TiN Bumps

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