WAFER TRANSFER APPARATUS FOR SEMICONDUCTOR POLISHING EQUIPMENT TO REMARKABLY SHORTEN INTERVAL OF TIME FOR LOADING AND UNLOADING WAFER

摘要

Purpose: the wafer transfer device for semiconductor polishing equipment, which is provided to, is significantly reduced a period, is used to load and unload a chip to a piston by simply increasing a sword coupling structure. Construction: a driving part (31) build the driving device (30) formed among the lower end of the passage of a piston (20) in as the main body with piston. When one end of a piece of sword (40) is horizontally to be horizontally connected to a driving axis to take out form transmission device in driving device, sword rotates and by using mutually corresponding one chip of Surface absorption with passing through the driving axial of a motor.