首页> 外国专利> METHOD OF FORMING MIM CAPACITOR USING INTERLAYER DIELECTRIC TO PREVENT SHORT BETWEEN UPPER AND LOWER ELECTRODES

METHOD OF FORMING MIM CAPACITOR USING INTERLAYER DIELECTRIC TO PREVENT SHORT BETWEEN UPPER AND LOWER ELECTRODES

机译:利用层间电介质形成MIM电容器以防止上下电极之间短路的方法

摘要

PURPOSE: A method of forming an MIM(Metal Insulator Metal) capacitor is provided to prevent short between an upper electrode and a lower electrode due to non-volatile metallic compound by using an interlayer dielectric made of oxide. CONSTITUTION: A first metal film(32) and an insulating layer(34) are sequentially deposited on a substrate(30) and patterned. An interlayer dielectric(36) is formed at sides of the patterned first metal film and the patterned insulating layer. A second metal film(38) is deposited on the patterned insulating layer and the interlayer dielectric and patterned. The thickness of the interlayer dielectric is the same as the total thickness of the first metal film and the insulating layer.
机译:目的:提供一种形成MIM(金属绝缘体金属)电容器的方法,以通过使用由氧化物制成的层间电介质来防止由于非挥发性金属化合物引起的上电极和下电极之间的短路。组成:第一金属膜(32)和绝缘层(34)依次沉积在基板(30)上并进行构图。在图案化的第一金属膜和图案化的绝缘层的侧面形成层间电介质(36)。在图案化的绝缘层和层间电介质上沉积第二金属膜(38)并进行图案化。层间电介质的厚度与第一金属膜和绝缘层的总厚度相同。

著录项

  • 公开/公告号KR20050005968A

    专利类型

  • 公开/公告日2005-01-15

    原文格式PDF

  • 申请/专利权人 MAGNACHIP SEMICONDUCTOR LTD.;

    申请/专利号KR20030045965

  • 发明设计人 JUNG SUK WON;

    申请日2003-07-08

  • 分类号H01L27/04;

  • 国家 KR

  • 入库时间 2022-08-21 22:05:59

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