首页> 外国专利> METHOD FOR FORMING WELL OF SEMICONDUCTOR DEVICE TO IMPROVE CHARACTERISTICS OF JUNCTION LEAKAGE CURRENT, INVERSE NARROW WIDTH EFFECT AND NARROW WIDTH EFFECT

METHOD FOR FORMING WELL OF SEMICONDUCTOR DEVICE TO IMPROVE CHARACTERISTICS OF JUNCTION LEAKAGE CURRENT, INVERSE NARROW WIDTH EFFECT AND NARROW WIDTH EFFECT

机译:形成半导体器件的阱以改善结漏电流,逆窄宽度效应和窄宽度效应的特性的方法

摘要

PURPOSE: A method for forming a well of a semiconductor device is provided to improve characteristics of a junction leakage current, an inverse narrow width effect and a narrow width effect by forming a well having impurity ions of a uniform doping density. CONSTITUTION: A trench is formed in a semiconductor substrate(11) by using a pad nitride layer as an etch mask such that the pad nitride layer is patterned to open a field region. An oxide layer is formed along the surface of the trench. An additional ion implantation process is performed to form an additional ion implantation layer on the sidewall of the trench. The trench is filled with an insulation material to form a field oxide layer(17). After the pad nitride layer is removed, a well(210) is formed in the semiconductor substrate by a well ion implantation process and an annealing process.
机译:目的:提供一种用于形成半导体器件的阱的方法,以通过形成具有均匀掺杂密度的杂质离子的阱来改善结漏电流,反窄宽度效应和窄宽度效应的特性。组成:在沟槽中,通过使用氮化镓层作为蚀刻掩模在半导体衬底(11)中形成沟槽,从而对氮化氮化物层进行构图以打开场区。沿着沟槽的表面形成氧化物层。执行附加的离子注入工艺以在沟槽的侧壁上形成附加的离子注入层。用绝缘材料填充沟槽以形成场氧化层(17)。在去除垫氮化物层之后,通过阱离子注入工艺和退火工艺在半导体衬底中形成阱(210)。

著录项

  • 公开/公告号KR20050010161A

    专利类型

  • 公开/公告日2005-01-27

    原文格式PDF

  • 申请/专利权人 MAGNACHIP SEMICONDUCTOR LTD.;

    申请/专利号KR20030049052

  • 发明设计人 CHOI MYUNG GYU;

    申请日2003-07-18

  • 分类号H01L21/76;

  • 国家 KR

  • 入库时间 2022-08-21 22:05:58

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