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NON-VOLATILE MEMORY DEVICE WITH THICK GATE OXIDE LAYER FOR IMPROVING DYNAMIC WRITE INHIBITION CHARACTERISTICS AND MANUFACTURING METHOD THEREOF
NON-VOLATILE MEMORY DEVICE WITH THICK GATE OXIDE LAYER FOR IMPROVING DYNAMIC WRITE INHIBITION CHARACTERISTICS AND MANUFACTURING METHOD THEREOF
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机译:厚栅氧化层的非易失性存储器件,用于改善动态写抑制特性及其制造方法
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摘要
PURPOSE: A non-volatile memory device and a manufacturing method thereof are provided to improve DWI(Dynamic Write Inhibition) characteristics of a non-volatile memory cell by using a thick gate oxide layer. CONSTITUTION: A source region(11), a source/drain region(13,15) and a drain region(17) are formed in a semiconductor substrate. A gate oxide layer(21) is formed on the source region and the drain region, respectively. A triple layer made of an oxide layer(31), a nitride layer(32) and an oxide layer(33) is formed between the gate oxide layer. At this time, the thickness of the gate oxide layer is in a range of 0.6 to 10 times of that of the triple layer.
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