SEMICONDUCTOR CHIP FOR INCREASING PROCESS UNIFORMITY BY ARRANGING PERIPHERAL CIRCUIT REGIONS HAVING LOW DENSITY OF CIRCUIT PATTERNS IN A RADIATIVE DIRECTION ON A CHIP

摘要

Purpose: semiconductor piece is arranged to increase the quantity of effective chip and improves process uniformity, by reducing one side die region in an edge of a chip. Construction: semiconductor piece (23) includes multiple cell regions (25) and multiple peripheral circuit regions (27). Semiconductor chip has a hexagonal structure, in order to form a honeycomb on chip. In the direction of a radiation of a middle section of semiconductor chip, peripheral circuit region is set. Cell region is made of a shape of parallelogram. Peripheral circuit region is further formed in an edge part of semiconductor chip.