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Cu-Ni-Si ALLOY HAVING EXCELLENT FATIGUE CHARACTERISTICS SUITABLY USED AS COPPER ALLOY FOR ELECTRONIC MATERIALS SUCH AS TERMINALS AND CONNECTORS
Cu-Ni-Si ALLOY HAVING EXCELLENT FATIGUE CHARACTERISTICS SUITABLY USED AS COPPER ALLOY FOR ELECTRONIC MATERIALS SUCH AS TERMINALS AND CONNECTORS
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机译:具有出色的疲劳特性的Cu-Ni-Si合金可作为铜合金用于电子材料(例如端子和连接器)
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摘要
PURPOSE: To improve fatigue characteristics of a Cu-Ni-Si alloy used in electronic materials including connectors. CONSTITUTION: Cu-Ni-Si alloy is characterized in that compression residual stress of 20 to 200 MPa exists on the surface of the alloy as a copper alloy containing 1.0 to 4.5 mass% of Ni, 0.2 to 1.2 mass% of Si, and the balance being Cu and inevitable impurities, wherein the maximum valley depth(Rv) on the surface of the alloy is 1 m or less, wherein the alloy has 100 or less of inclusions/mm¬2, the inclusions having diameter of 4 m or more, and wherein the alloy contains 0.05 to 0.3 mass% of Mg, 0.01 to 0.5 mass% of P, 0.01 to 1.5 mass% of Sn, 0.01 to 1.5 mass% of Zn, and 1 mass% or less of one or more elements selected from Fe, Co, Cr, Zr, Ti, Ag, Mn and Al.
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机译:目的:改善包括连接器在内的电子材料中使用的Cu-Ni-Si合金的疲劳特性。组成:Cu-Ni-Si合金的特征在于,作为含有1.0〜4.5质量%的Ni,0.2〜1.2质量%的Si,以及1.0〜4.5质量%的Si的铜合金,该合金的表面存在20〜200 MPa的压缩残余应力。余量为铜和不可避免的杂质,其中合金表面上的最大谷深(Rv)为1 m或更小,其中合金的夹杂物/ mm 2为100或更小,夹杂物的直径为4 m或更大,并且其中所述合金包含0.05至0.3质量%的Mg,0.01至0.5质量%的P,0.01至1.5质量%的Sn,0.01至1.5质量%的Zn和1质量%以下的一种或多种所选元素。由铁,钴,铬,锆,钛,银,锰和铝组成。
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