首页> 外国专利> METHOD FOR FORMING PATTERN, METHOD FOR FORMING INTERCONNECTION PATTERN, ELECTRICAL OPTICAL DEVICE AND ELECTRONIC INSTRUMENT TO EVAPORATE OR ANALYZE THIN FILM OF DESIRED REGION AND PATTERN THIN FILM

METHOD FOR FORMING PATTERN, METHOD FOR FORMING INTERCONNECTION PATTERN, ELECTRICAL OPTICAL DEVICE AND ELECTRONIC INSTRUMENT TO EVAPORATE OR ANALYZE THIN FILM OF DESIRED REGION AND PATTERN THIN FILM

机译:形成图案的方法,形成互连图案的方法,光学器件和电子仪器以蒸发或分析所需区域和图案薄膜的薄膜

摘要

PURPOSE: A method for forming a pattern is provided to evaporate or analyze a thin film of a desired region and pattern a thin film by installing a sublimation material on or in a base member. CONSTITUTION: A thin film(2) is formed on a base member(1) including a sublimation material. Light is irradiated to the base member. The sublimation material in a desired region is sublimed by the heat generated by the irradiation of the light. The thin film corresponding to the irradiation region is eliminated to pattern the thin film.
机译:目的:提供一种形成图案的方法,以蒸发或分析所需区域的薄膜,并通过将升华材料安装在基础构件之上或之中而对薄膜进行图案化。构成:在包含升华材料的基础构件(1)上形成薄膜(2)。光照射到基座构件。所需区域中的升华材料被光照射产生的热量升华。消除与照射区域相对应的薄膜以使该薄膜图案化。

著录项

  • 公开/公告号KR20050017591A

    专利类型

  • 公开/公告日2005-02-22

    原文格式PDF

  • 申请/专利权人 SEIKO EPSON CORPORATION;

    申请/专利号KR20040063269

  • 发明设计人 TOYODA NAOYUKI;

    申请日2004-08-11

  • 分类号H01L21/20;

  • 国家 KR

  • 入库时间 2022-08-21 22:05:51

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号