SEMICONDUCTOR MODULE WITH GROUP MOLDING PORTION TO COPE WITH CHANGE OF SEMICONDUCTOR CHIP SIZE USING GROUP MOLDING METHOD

摘要

PURPOSE: A semiconductor module with a group molding portion is provided to cope with the change of the semiconductor chip size and the semiconductor module layout by converting the individual molding method into the group molding method in the seal of a semiconductor device. CONSTITUTION: Semiconductor devices(110) are mounted on a module board(102). Individual devices(104) are also mounted on the module board. A group molding portion(120) is formed by sealing simultaneously two or more of semiconductor devices. The semiconductor devices are a kind of WLP(Wafer Level Package) that solder balls are attached onto a bare chip. The semiconductor devices are mounted on the both surfaces of the upper and lower sides of the module board.