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PLASMA APPARATUS WITH DEVICE FOR REDUCING POLYMER DEPOSITION ON A SUBSTRATE AND METHOD FOR REDUCING POLYMER DEPOSITION
PLASMA APPARATUS WITH DEVICE FOR REDUCING POLYMER DEPOSITION ON A SUBSTRATE AND METHOD FOR REDUCING POLYMER DEPOSITION
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机译:具有用于减少基材上聚合物沉积的装置的等离子体设备和用于降低聚合物沉积的方法
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摘要
An adjustable RF coupling ring is capable of reducing a vertical gap between a substrate and a hot edge ring in a vacuum processing chamber. The reduction of the gap reduces polymer deposits on the substrate and electrostatic chuck and improves wafer processing.
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